WL

Wei-Jung Lin

TSMC: 5 patents #415 of 2,832Top 15%
Overall (2017): #24,449 of 506,227Top 5%
5
Patents 2017

Issued Patents 2017

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
9735107 Contact structure and formation thereof Hong-Mao Lee, Huicheng Chang, Chia-Han Lai, Chi-Hsuan Ni, Cheng-Tung Lin +4 more 2017-08-15
9711402 Method of forming contact metal Chun-Hsien Huang, Hong-Mao Lee, Hsien-Lung Yang, Yu-Kai Chen 2017-07-18
9624576 Systems and methods for gap filling improvement Chi-Yuan Chen, Li-Ting Wang, Teng-Chun Tsai, Chun-I Tsai, Huang-Yi Huang +2 more 2017-04-18
9627313 Opening fill process and structure formed thereby Chun-I Tsai, Chi-Yuan Chen, Chia-Han Lai 2017-04-18
9589892 Interconnect structure and method of forming the same Yu-Hung Lin, Mei-Hui Fu, You-Hua Chou, Chia-Lin Hsu, Hon-Lin Huang +1 more 2017-03-07