Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847315 | Packages, packaging methods, and packaged semiconductor devices | Szu-Wei Lu, Jui-Pin Hung, Jing-Cheng Lin | 2017-12-19 |
| 9831224 | Solution for reducing poor contact in info packages | Jing-Cheng Lin, Chen-Hua Yu, Szu-Wei Lu, Shin-Puu Jeng | 2017-11-28 |
| 9793187 | 3D packages and methods for forming the same | Kung-Chen Yeh, Szu-Wei Lu, Jing-Cheng Lin | 2017-10-17 |