KY

Kung-Chen Yeh

TSMC: 1 patents #1,425 of 2,832Top 55%
Overall (2017): #339,946 of 506,227Top 70%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9793187 3D packages and methods for forming the same Shih-Ting Lin, Szu-Wei Lu, Jing-Cheng Lin 2017-10-17