| 9847309 |
Semiconductor device and method of forming vertical interconnect structure between semiconductor die and substrate |
— |
2017-12-19 |
| 9780057 |
Semiconductor device and method of forming pad layout for flipchip semiconductor die |
— |
2017-10-03 |
| 9773685 |
Solder joint flip chip interconnection having relief structure |
KyungOe Kim, TaeWoo Kang |
2017-09-26 |
| 9754897 |
Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits |
Yaojian Lin, Byung Joon Han, Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi +1 more |
2017-09-05 |
| 9679824 |
Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP |
Reza A. Pagaila, Jun Mo Koo |
2017-06-13 |
| 9679811 |
Semiconductor device and method of confining conductive bump material with solder mask patch |
— |
2017-06-13 |
| 9545013 |
Flip chip interconnect solder mask |
— |
2017-01-10 |
| 9545014 |
Flip chip interconnect solder mask |
— |
2017-01-10 |