TK

TaeWoo Kang

SC Stats Chippac: 1 patents #50 of 128Top 40%
Overall (2017): #225,887 of 506,227Top 45%
1
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9773685 Solder joint flip chip interconnection having relief structure Rajendra D. Pendse, KyungOe Kim 2017-09-26