| 9852979 |
Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips |
Frank Stepniak, Saumya Gandhi |
2017-12-26 |
| 9842797 |
Stacked die power converter |
Brian Ashley Carpenter, Christopher J. Sanzo, William Todd Harrison, Alok Kumar Lohia |
2017-12-12 |
| 9780017 |
Packaged device with additive substrate surface modification |
Benjamin Stassen Cook, Juan Alejandro Herbsommer, Yong Lin, Rongwei Zhang, Abram Castro |
2017-10-03 |
| 9768130 |
Integrated power package |
Christopher Daniel Manack |
2017-09-19 |
| 9679864 |
Printed interconnects for semiconductor packages |
Benjamin Stassen Cook, Juan Alejandro Herbsommer, Steven Kummerl, Wei-Yan Shih |
2017-06-13 |
| 9647329 |
Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide |
Juan Alejandro Herbsommer |
2017-05-09 |
| 9572261 |
Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips |
Frank Stepniak, Saumya Gandhi |
2017-02-14 |