Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852979 | Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips | Matthew David Romig, Frank Stepniak | 2017-12-26 |
| 9572261 | Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips | Matthew David Romig, Frank Stepniak | 2017-02-14 |