Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780017 | Packaged device with additive substrate surface modification | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Yong Lin, Abram Castro, Matthew David Romig | 2017-10-03 |
| 9780060 | Packaged IC with solderable sidewalls | Yong Lin, Vikas Gupta | 2017-10-03 |
| 9601414 | Method for preventing die pad delamination | Abram Castro | 2017-03-21 |