Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780017 | Packaged device with additive substrate surface modification | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Yong Lin, Rongwei Zhang, Matthew David Romig | 2017-10-03 |
| 9601414 | Method for preventing die pad delamination | Rongwei Zhang | 2017-03-21 |
| 9536781 | Method of making integrated circuit | Bernardo Gallegos | 2017-01-03 |