Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780060 | Packaged IC with solderable sidewalls | Yong Lin, Rongwei Zhang | 2017-10-03 |
| 9682286 | Ball for ball games, and method for manufacturing ball for ball games | Hideomi Shishido, Vinod Mahajan | 2017-06-20 |