Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9751108 | Extended range ultrasound transducer | Xiaochen Xu | 2017-09-05 |
| 9679864 | Printed interconnects for semiconductor packages | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Matthew David Romig, Steven Kummerl | 2017-06-13 |
| 9630835 | Wafer level packaging of MEMS | Stuart M. Jacobsen | 2017-04-25 |