Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679864 | Printed interconnects for semiconductor packages | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Matthew David Romig, Wei-Yan Shih | 2017-06-13 |
| 9646906 | Semiconductor package with printed sensor | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Django Trombley, Paul Merle Emerson | 2017-05-09 |