Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9679864 | Printed interconnects for semiconductor packages | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Matthew David Romig, Wei-Yan Shih | 2017-06-13 | $16,333,000 |
| 9646906 | Semiconductor package with printed sensor | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Django Trombley, Paul Merle Emerson | 2017-05-09 | $12,170,000 |