Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9851379 | Test probe substrate | Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski | 2017-12-26 |
| 9795964 | Direct bond transfer layers for manufacturable sealing of microfluidic chips | Joshua T. Smith, Chao Wang, Benjamin H. Wunsch | 2017-10-24 |
| 9748131 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2017-08-29 |
| 9648782 | Chip stack structures that implement two-phase cooling with radial flow | Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong | 2017-05-09 |
| 9636782 | Wafer debonding using mid-wavelength infrared radiation ablation | Bing Dang, John U. Knickerbocker | 2017-05-02 |
| 9606142 | Test probe substrate | Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski | 2017-03-28 |
| 9601364 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2017-03-21 |
| 9586291 | Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release | Bing Dang, John U. Knickerbocker, Eric P. Lewandowski | 2017-03-07 |