CA

Charles L. Arvin

IBM: 12 patents #332 of 10,852Top 4%
Globalfoundries: 6 patents #67 of 1,311Top 6%
Overall (2017): #2,110 of 506,227Top 1%
18
Patents 2017

Issued Patents 2017

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
9853006 Semiconductor device contact structure having stacked nickel, copper, and tin layers Harry D. Cox, Eric D. Perfecto, Thomas A. Wassick 2017-12-26
9804498 Filtering lead from photoresist stripping solution Harry D. Cox, Arthur G. Merryman, Jennifer D. Schuler 2017-10-31
9799618 Mixed UBM and mixed pitch on a single die Christopher D. Muzzy 2017-10-24
9793232 All intermetallic compound with stand off feature and method to make Luc Guerin, Sylvain E. Ouimet, Sylvain Pharand, Thomas A. Wassick 2017-10-17
9777388 Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solution Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres 2017-10-03
9741682 Structures to enable a full intermetallic interconnect Christopher D. Muzzy, Wolfgang Sauter 2017-08-22
9735071 Method of forming a temporary test structure for device fabrication Brian M. Erwin, Gary W. Maier 2017-08-15
9728440 Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer Harry D. Cox, Brian M. Erwin, Jorge A. Lubguban, Eric D. Perfecto, Jennifer D. Schuler 2017-08-08
9689084 Electrodeposition systems and methods that minimize anode and/or plating solution degradation Harry D. Cox, Eric D. Perfecto 2017-06-27
9679796 Anodized metal on carrier wafer Harry D. Cox, Jorge A. Lubguban, Jennifer D. Schuler 2017-06-13
9679806 Nanowires for pillar interconnects Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter 2017-06-13
9640492 Laminate warpage control Brian M. Erwin, Brian W. Quinlan 2017-05-02
9604316 Tin-based solder composition with low void characteristic Mark S. Chace, Qin Yuan, Nitin Jadhav, Janine L. Protzman 2017-03-28
9601423 Under die surface mounted electrical elements Jon A. Casey, Brian M. Erwin, Steven P. Ostrander, Brian W. Quinlan 2017-03-21
9583451 Conductive pillar shaped for solder confinement Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter 2017-02-28
9574283 Rinsing and drying for electrochemical processing Raschid J. Bezama, Hariklia Deligianni 2017-02-21
9565777 Security mesh and method of making Brian M. Erwin 2017-02-07
9546433 Separation of alpha emitting species from plating baths Michael S. Gordon 2017-01-17