| 9793214 |
Heterostructure interconnects for high frequency applications |
Archana Venugopal, Luigi Colombo, Robert Reid Doering |
2017-10-17 |
| 9780017 |
Packaged device with additive substrate surface modification |
Juan Alejandro Herbsommer, Yong Lin, Rongwei Zhang, Abram Castro, Matthew David Romig |
2017-10-03 |
| 9761950 |
Dielectric waveguide with embedded antenna |
Juan Alejandro Herbsommer |
2017-09-12 |
| 9761543 |
Integrated circuits with thermal isolation and temperature regulation |
Barry Jon Male, Robert A. Neidorff, Steve Kummerl |
2017-09-12 |
| 9696490 |
Matching impedance of a dielectric waveguide to a launching mechanism |
Juan Alejandro Herbsommer |
2017-07-04 |
| 9679864 |
Printed interconnects for semiconductor packages |
Juan Alejandro Herbsommer, Matthew David Romig, Steven Kummerl, Wei-Yan Shih |
2017-06-13 |
| 9659844 |
Semiconductor die substrate with integral heat sink |
Rajarshi Mukhopadhyay, Daniel N. Carothers |
2017-05-23 |
| 9646906 |
Semiconductor package with printed sensor |
Juan Alejandro Herbsommer, Django Trombley, Steven Kummerl, Paul Merle Emerson |
2017-05-09 |
| 9614584 |
Simultaneous launching of multiple signal channels in a dielectric waveguide using different electromagnetic modes |
Juan Alejandro Herbsommer |
2017-04-04 |
| 9601820 |
Dielectric waveguide comprised of a core surrounded by a cladding and forming integrated periodical structures |
Juan Alejandro Herbsommer |
2017-03-21 |
| 9590699 |
Guided near field communication for short range data communication |
Swaminathan Sankaran, Bradley Allen Kramer, Juan Alejandro Herbsommer, Lutz Naumann, Mark W. Morgan +1 more |
2017-03-07 |
| 9548523 |
Waveguide formed with a dielectric core surrounded by conductive layers including a conformal base layer that matches the footprint of the waveguide |
Juan Alejandro Herbsommer |
2017-01-17 |