Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793214 | Heterostructure interconnects for high frequency applications | Archana Venugopal, Benjamin Stassen Cook, Robert Reid Doering | 2017-10-17 |
| 9698075 | Integration of backside heat spreader for thermal management | Archana Venugopal, Marie Denison, Hiep Xuan Nguyen, Darvin R. Edwards | 2017-07-04 |