Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more | 2017-11-14 |
| 9646903 | Thermoset polymides for microelectronic applications | Stephen Lehman, Saikumar Jayaraman | 2017-05-09 |
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2017-04-04 |
| 9604210 | Controlled fluid delivery in a microelectronic package | Lakshmi Supriya, Nirupama Chakrapani | 2017-03-28 |