Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9576875 | Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements | Reinhard Hess, Katharina Umminger, Gabriel Maier, Markus Menath, Hannes Eder +1 more | 2017-02-21 |
| 9570352 | Method of dicing a wafer and semiconductor chip | Markus Brunnbauer, Bernhard Drummer, Korbinian Kaspar | 2017-02-14 |