Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831127 | Method of processing a semiconductor substrate and semiconductor chip | Franco Mariani | 2017-11-28 |
| 9570352 | Method of dicing a wafer and semiconductor chip | Markus Brunnbauer, Bernhard Drummer, Gunther Mackh | 2017-02-14 |