Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9570352 | Method of dicing a wafer and semiconductor chip | Markus Brunnbauer, Korbinian Kaspar, Gunther Mackh | 2017-02-14 |
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Bernhard Drummer
Overall (2017): #480,753 of 506,227Top 95%
1
Patents 2017