Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627287 | Thinning in package using separation structure as stop | Manfred Engelhardt, Edward Fuergut | 2017-04-18 |
| 9576875 | Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements | Reinhard Hess, Katharina Umminger, Gabriel Maier, Markus Menath, Gunther Mackh +1 more | 2017-02-21 |