Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837288 | Semiconductor power package and method of manufacturing the same | Thomas Basler, Christian Kasztelan, Ralf Otremba | 2017-12-05 |
| 9768037 | Electronic device package including metal blocks | Petteri Palm, Irmgard Escher-Poeppel | 2017-09-19 |
| 9698070 | Arrangement having a plurality of chips and a chip carrier, and a processing arrangement | Michael Ledutke | 2017-07-04 |
| 9666499 | Semiconductor device with encapsulant | Joachim Mahler, Khalil Hosseini, Georg Meyer-Berg | 2017-05-30 |
| 9627287 | Thinning in package using separation structure as stop | Manfred Engelhardt, Hannes Eder | 2017-04-18 |
| 9595502 | Spring contact for semiconductor chip | Olaf Hohlfeld, Horst Groeninger, Juergen Hoegerl | 2017-03-14 |
| 9593009 | Apparatus comprising and a method for manufacturing an embedded MEMS device | Horst Theuss, Rainer Leuschner | 2017-03-14 |
| 9589859 | Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Gottfried Beer, Juergen Hoegerl, Olaf Hohlfeld, Peter Kanschat | 2017-03-07 |
| 9584889 | System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille | Irmgard Escher-Poeppel, Alfons Dehe | 2017-02-28 |