OH

Olaf Hohlfeld

Infineon Technologies Ag: 8 patents #22 of 917Top 3%
📍 Warstein, DE: #1 of 13 inventorsTop 8%
Overall (2017): #10,955 of 506,227Top 3%
8
Patents 2017

Issued Patents 2017

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDate
9818730 Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement Gottfried Beer, Irmgard Escher-Poeppel, Juergen Hoegerl, Peter Kanschat 2017-11-14
9688060 Method for producing a composite and a power semiconductor module Reinhold Bayerer 2017-06-27
9640511 Method for producing a circuit carrier arrangement having a carrier which has a surface formed by an aluminum/silicon carbide metal matrix composite material 2017-05-02
9627356 Semiconductor module, semiconductor module arrangement and method for operating a semiconductor module 2017-04-18
9620459 Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement Gottfried Beer, Irmgard Escher-Poeppel, Juergen Hoegerl, Peter Kanschat 2017-04-11
9609748 Semiconductor module comprising printed circuit board and method for producing a semiconductor module comprising a printed circuit board 2017-03-28
9595502 Spring contact for semiconductor chip Edward Fuergut, Horst Groeninger, Juergen Hoegerl 2017-03-14
9589859 Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement Gottfried Beer, Edward Fuergut, Juergen Hoegerl, Peter Kanschat 2017-03-07