Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818730 | Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement | Irmgard Escher-Poeppel, Juergen Hoegerl, Olaf Hohlfeld, Peter Kanschat | 2017-11-14 |
| 9721920 | Embedded chip packages and methods for manufacturing an embedded chip package | Walter Hartner | 2017-08-01 |
| 9711462 | Package arrangement including external block comprising semiconductor material and electrically conductive plastic material | Dominic Maier, Ulrich Wachter, Daniel Kehrer | 2017-07-18 |
| 9620459 | Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement | Irmgard Escher-Poeppel, Juergen Hoegerl, Olaf Hohlfeld, Peter Kanschat | 2017-04-11 |
| 9620457 | Semiconductor device packaging | Ulrich Wachter, Eva Wagner | 2017-04-11 |
| 9589859 | Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Edward Fuergut, Juergen Hoegerl, Olaf Hohlfeld, Peter Kanschat | 2017-03-07 |
| 9553208 | Current sensor device | Volker Strutz, Horst Theuss | 2017-01-24 |