Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806056 | Method of packaging integrated circuits | Ulrich Wachter, Thomas Kilger | 2017-10-31 |
| 9725303 | Semiconductor device including a MEMS die and a conductive layer | Franz-Xaver Muehlbauer, Thomas Kilger | 2017-08-08 |
| 9711462 | Package arrangement including external block comprising semiconductor material and electrically conductive plastic material | Gottfried Beer, Ulrich Wachter, Daniel Kehrer | 2017-07-18 |