Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806056 | Method of packaging integrated circuits | Ulrich Wachter, Dominic Maier | 2017-10-31 |
| 9725303 | Semiconductor device including a MEMS die and a conductive layer | Dominic Maier, Franz-Xaver Muehlbauer | 2017-08-08 |
| 9718678 | Package arrangement, a package, and a method of manufacturing a package arrangement | Ulrich Wachter | 2017-08-01 |
| 9704843 | Integrated system and method of making the integrated system | — | 2017-07-11 |