KU

Katharina Umminger

Infineon Technologies Ag: 1 patents #362 of 917Top 40%
📍 Lappersdorf, DE: #10 of 22 inventorsTop 50%
Overall (2017): #352,089 of 506,227Top 70%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9576875 Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements Reinhard Hess, Gabriel Maier, Markus Menath, Gunther Mackh, Hannes Eder +1 more 2017-02-21