GM

Gabriel Maier

Infineon Technologies Ag: 1 patents #362 of 917Top 40%
📍 Regensburg, DE: #122 of 287 inventorsTop 45%
Overall (2017): #419,463 of 506,227Top 85%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9576875 Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements Reinhard Hess, Katharina Umminger, Markus Menath, Gunther Mackh, Hannes Eder +1 more 2017-02-21