| 9773698 |
Method of manufacturing an ultra low dielectric layer |
Geraud Jean-Michel Dubois, Gregory M. Fritz, Teddie Peregrino Magbitang, Hiroyuki Miyazoe, Willi Volksen |
2017-09-26 |
| 9653395 |
Hybrid subtractive etch/metal fill process for fabricating interconnects |
Gregory M. Fritz, Eric A. Joseph, Hiroyuki Miyazoe |
2017-05-16 |
| 9646881 |
Hybrid subtractive etch/metal fill process for fabricating interconnects |
Gregory M. Fritz, Eric A. Joseph, Hiroyuki Miyazoe |
2017-05-09 |
| 9636675 |
Pillar array structure with uniform and high aspect ratio nanometer gaps |
Yann Astier, Joshua T. Smith, Chao Wang, Benjamin H. Wunsch |
2017-05-02 |
| 9633948 |
Low energy etch process for nitrogen-containing dielectric layer |
Markus Brink, Sebastian U. Engelmann, Nicholas C. M. Fuller, Hiroyuki Miyazoe, Masahiro Nakamura |
2017-04-25 |
| 9615851 |
Method and apparatus for insertion of a sensor |
Mark Neinast, W. Kenneth Ward, Richard G. Sass, Jon A. Fortuna |
2017-04-11 |
| 9536731 |
Wet clean process for removing CxHyFz etch residue |
Sebastian U. Engelmann, Eric A. Joseph, Mahmoud Khojasteh, Masahiro Nakamura, Satyavolu S. Papa Rao +3 more |
2017-01-03 |