Robert L. Bruce — 7 Patents at IBM

Issued Patents 2017

Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9773698	Method of manufacturing an ultra low dielectric layer	Geraud Jean-Michel Dubois, Gregory M. Fritz, Teddie Peregrino Magbitang, Hiroyuki Miyazoe, Willi Volksen	2017-09-26	$3,108,000
9653395	Hybrid subtractive etch/metal fill process for fabricating interconnects	Gregory M. Fritz, Eric A. Joseph, Hiroyuki Miyazoe	2017-05-16	$2,370,000
9646881	Hybrid subtractive etch/metal fill process for fabricating interconnects	Gregory M. Fritz, Eric A. Joseph, Hiroyuki Miyazoe	2017-05-09	$2,584,000
9636675	Pillar array structure with uniform and high aspect ratio nanometer gaps	Yann Astier, Joshua T. Smith, Chao Wang, Benjamin H. Wunsch	2017-05-02	$3,833,000
9633948	Low energy etch process for nitrogen-containing dielectric layer	Markus Brink, Sebastian U. Engelmann, Nicholas C. M. Fuller, Hiroyuki Miyazoe, Masahiro Nakamura	2017-04-25	$7,864,000
9615851	Method and apparatus for insertion of a sensor	Mark Neinast, W. Kenneth Ward, Richard G. Sass, Jon A. Fortuna	2017-04-11
9536731	Wet clean process for removing CxHyFz etch residue	Sebastian U. Engelmann, Eric A. Joseph, Mahmoud Khojasteh, Masahiro Nakamura, Satyavolu S. Papa Rao +3 more	2017-01-03	$2,646,000