| 9793108 |
Interconnect integration for sidewall pore seal and via cleanliness |
Mehul Naik, Deenesh Padhi, Priyanka DASH, Bhaskar Kumar, Alexandros T. Demos |
2017-10-17 |
| 9761489 |
Self-aligned interconnects formed using substractive techniques |
Bencherki Mebarki, Huixiong Dai, Yongmei Chen, Mehul Naik |
2017-09-12 |
| 9646876 |
Aluminum nitride barrier layer |
Deenesh Padhi, Srinivas Guggilla, Alexandros T. Demos, Bhaskar Kumar, Priyanka DASH |
2017-05-09 |
| 9640424 |
Integrated metal spacer and air gap interconnect |
Mehul Naik |
2017-05-02 |
| 9601431 |
Dielectric/metal barrier integration to prevent copper diffusion |
Mehul Naik, Yong Cao, Mei-Yee Shek, Yana Cheng, Sree Rangasai V. Kesapragada |
2017-03-21 |
| 9576810 |
Process for etching metal using a combination of plasma and solid state sources |
Subhash Deshmukh, Joseph R. Johnson, Jingjing Liu |
2017-02-21 |
