Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9850574 | Forming a low-k dielectric layer with reduced dielectric constant and strengthened mechanical properties | Taewan Kim, Kang Sub Yim | 2017-12-26 |
| 9793108 | Interconnect integration for sidewall pore seal and via cleanliness | He Ren, Mehul Naik, Deenesh Padhi, Priyanka DASH, Bhaskar Kumar | 2017-10-17 |
| 9659765 | Enhancement of modulus and hardness for UV-cured ultra low-k dielectric films | Kang Sub Yim, Mahendra CHHABRA, Kelvin Chan, Priyanka DASH | 2017-05-23 |
| 9646876 | Aluminum nitride barrier layer | Deenesh Padhi, Srinivas Guggilla, Bhaskar Kumar, He Ren, Priyanka DASH | 2017-05-09 |
| 9613908 | Ultra-thin dielectric diffusion barrier and etch stop layer for advanced interconnect applications | Deenesh Padhi, Yihong Chen, Kelvin Chan, Abhijit Basu Mallick, Mukund Srinivasan | 2017-04-04 |
| 9580801 | Enhancing electrical property and UV compatibility of ultrathin blok barrier film | Xiaolan Ba, Weifeng YE, Mei-Yee Shek, Yu Jin, Li-Qun Xia +1 more | 2017-02-28 |