| 9842744 |
Methods for etch of SiN films |
Jingchun Zhang, Nitin K. Ingle |
2017-12-12 |
| 9837284 |
Oxide etch selectivity enhancement |
Zhijun Chen, Nitin K. Ingle |
2017-12-05 |
| 9831097 |
Methods for selective etching of a silicon material using HF gas without nitrogen etchants |
Nitin K. Ingle, Zihui Li, Mikhail Korolik |
2017-11-28 |
| 9768034 |
Removal methods for high aspect ratio structures |
Lin Xu, Zhijun Chen, Jiayin Huang |
2017-09-19 |
| 9754800 |
Selective etch for silicon films |
Jingchun Zhang, Nitin K. Ingle |
2017-09-05 |
| 9704723 |
Processing systems and methods for halide scavenging |
Xinglong Chen, Zihui Li, Hiroshi Hamana, Zhijun Chen, Ching-Mei Hsu +5 more |
2017-07-11 |
| 9659791 |
Metal removal with reduced surface roughness |
Xikun Wang, David Cui, Nitin K. Ingle |
2017-05-23 |
| 9659792 |
Processing systems and methods for halide scavenging |
Xinglong Chen, Zihui Li, Hiroshi Hamana, Zhijun Chen, Ching-Mei Hsu +5 more |
2017-05-23 |
| 9653310 |
Methods for selective etching of a silicon material |
Zihui Li, Xing-Fu Zhong, Nitin K. Ingle |
2017-05-16 |
| 9613822 |
Oxide etch selectivity enhancement |
Zhijun Chen, Nitin K. Ingle |
2017-04-04 |
| 9607856 |
Selective titanium nitride removal |
Xikun Wang, Nitin K. Ingle, Dmitry Lubomirsky |
2017-03-28 |
| 9576815 |
Gas-phase silicon nitride selective etch |
Jingjing Xu, Fei Wang, Nitin K. Ingle, Robert Jan Visser |
2017-02-21 |
| 9576809 |
Etch suppression with germanium |
Mikhail Korolik, Nitin K. Ingle, Jingchun Zhang, Jie Liu |
2017-02-21 |
| 9576788 |
Cleaning high aspect ratio vias |
Jie Liu, Seung Ho Park, Zhenjiang Cui, Nitin K. Ingle |
2017-02-21 |
| 9564341 |
Gas-phase silicon oxide selective etch |
Jingjing Xu, Nitin K. Ingle |
2017-02-07 |
| 9553102 |
Tungsten separation |
Xikun Wang, Jie Liu, Nitin K. Ingle |
2017-01-24 |
