Issued Patents 2016
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9236277 | Integrated circuit with a thermally conductive underfill and methods of forming same | Chen-Hua Yu | 2016-01-12 |
| 9230911 | Interconnect structure and method of forming the same | Cheng-Hsiung Tsai, Chung-Ju Lee, Hai-Ching Chen, Shau-Lin Shue | 2016-01-05 |
| 9230809 | Self-aligned double patterning | Yu-Sheng Chang, Chung-Ju Lee | 2016-01-05 |