Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520370 | Methods of forming semiconductor device assemblies and interconnect structures, and related semiconductor device assemblies and interconnect structures | — | 2016-12-13 |
| 9515002 | Bonding pads with thermal pathways | James M. Derderian, Sameer S. Vadhavkar, Jian Li | 2016-12-06 |
| 9449940 | Methods and structures for processing semiconductor devices using polymeric materials and adhesives | — | 2016-09-20 |
| 9443744 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, James M. Derderian +1 more | 2016-09-13 |
| 9412675 | Interconnect structure with improved conductive properties and associated systems and methods | Wayne H. Huang, James M. Derderian | 2016-08-09 |
| 9362143 | Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages | Yangyang SUN, Michel Koopmans, Josh D. Woodland, Brandon P. Wirz | 2016-06-07 |
| 9337119 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated systems | Sameer S. Vadhavkar, Xiao Li | 2016-05-10 |
| 9318438 | Semiconductor structures comprising at least one through-substrate via filled with conductive materials | Mark Bossler, Christopher J. Gambee, Randall S. Parker | 2016-04-19 |
| 9299663 | Semiconductor devices and methods for backside photo alignment | Brandon P. Wirz, Keith E. Ypma, Christopher J. Gambee, Kevin M. Dowdle, Irina Vasilyeva +2 more | 2016-03-29 |