Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515002 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, Sameer S. Vadhavkar, Jian Li | 2016-12-06 |
| 9443744 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2016-09-13 |
| 9412675 | Interconnect structure with improved conductive properties and associated systems and methods | Jaspreet S. Gandhi, Wayne H. Huang | 2016-08-09 |