Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515002 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, James M. Derderian, Jian Li | 2016-12-06 |
| 9443744 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2016-09-13 |
| 9397078 | Semiconductor device assembly with underfill containment cavity | Anilkumar Chandolu, Wayne H. Huang | 2016-07-19 |
| 9337119 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated systems | Xiao Li, Jaspreet S. Gandhi | 2016-05-10 |