Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9318438 | Semiconductor structures comprising at least one through-substrate via filled with conductive materials | Jaspreet S. Gandhi, Christopher J. Gambee, Randall S. Parker | 2016-04-19 | $6,825,000 |