Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379091 | Semiconductor die assemblies and semiconductor devices including same | Luke England, Paul A. Silvestri | 2016-06-28 |
| 9362143 | Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages | Yangyang SUN, Jaspreet S. Gandhi, Josh D. Woodland, Brandon P. Wirz | 2016-06-07 |
| 9287240 | Stacked semiconductor die assemblies with thermal spacers and associated systems and methods | Jian Li, Steven K. Groothuis | 2016-03-15 |
| 9269700 | Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods | Shijian Luo, David R. Hembree | 2016-02-23 |