Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362143 | Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages | Yangyang SUN, Michel Koopmans, Jaspreet S. Gandhi, Josh D. Woodland | 2016-06-07 |
| 9299663 | Semiconductor devices and methods for backside photo alignment | Keith E. Ypma, Christopher J. Gambee, Jaspreet S. Gandhi, Kevin M. Dowdle, Irina Vasilyeva +2 more | 2016-03-29 |