Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466659 | Fabrication of multilayer circuit elements | Mahesh Bhatkar, Wanbing Yi, Juan Boon Tan | 2016-10-11 |
| 9397073 | Method of using a back-end-of-line connection structure to distribute current envenly among multiple TSVs in a series for delivery to a top die | — | 2016-07-19 |
| 9379091 | Semiconductor die assemblies and semiconductor devices including same | Paul A. Silvestri, Michel Koopmans | 2016-06-28 |
| 9257383 | Method and device for an integrated trench capacitor | — | 2016-02-09 |