Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443744 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2016-09-13 |
| 9269700 | Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods | Michel Koopmans, Shijian Luo | 2016-02-23 |