Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502288 | Method of forming an interconnect structure | Son V. Nguyen, Alfred Grill, Thomas J. Haigh, Jr., Hosadurga Shobha | 2016-11-22 |
| 9472457 | Manganese oxide hard mask for etching dielectric materials | Wei Lin, Spyridon Skordas | 2016-10-18 |
| 9412629 | Wafer bonding for 3D device packaging fabrication | Son V. Nguyen, Vamsi K. Paruchuri, Deepika Priyadarshini | 2016-08-09 |
| 9263366 | Liquid cooling of semiconductor chips utilizing small scale structures | Wei Lin, Son V. Nguyen, Spyridon Skordas | 2016-02-16 |