| 9502390 |
BVA interposer |
Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman, Pezhman Monadgemi +3 more |
2016-11-22 |
| 9433100 |
Low-stress TSV design using conductive particles |
Charles G. Woychik, Kishor Desai, Ilyas Mohammed |
2016-08-30 |
| 9398700 |
Method of forming a reliable microelectronic assembly |
Cyprian Emeka Uzoh, Belgacem Haba, Charles G. Woychik, Michael Newman |
2016-07-19 |
| 9379008 |
Metal PVD-free conducting structures |
Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman, Pezhman Monadgemi |
2016-06-28 |
| 9355905 |
Methods and structure for carrier-less thin wafer handling |
Cyprian Emeka Uzoh, Pezhman Monadgemi, Michael Newman, Charles G. Woychik |
2016-05-31 |
| 9349669 |
Reduced stress TSV and interposer structures |
Cyprian Emeka Uzoh, Charles G. Woychik, Kishor Desai, Huailiang Wei, Craig Mitchell +1 more |
2016-05-24 |
| 9237648 |
Carrier-less silicon interposer |
Michael Newman, Cyprian Emeka Uzoh, Charles G. Woychik, Pezhman Monadgemi |
2016-01-12 |