Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425181 | Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Yan Huo, Zhiqiang Niu +1 more | 2016-08-23 |