Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406579 | Semiconductor device and method of controlling warpage in semiconductor package | DaeSik Choi, Sang Mi Park, WonIl Kwon, YiSu Park | 2016-08-02 |
| 9401289 | Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces | Minjung Kim, KyungHoon Lee, WonIl Kwon, DaeSik Choi | 2016-07-26 |
| 9390945 | Semiconductor device and method of depositing underfill material with uniform flow rate | KyungHoon Lee, Sang Mi Park, DaeSik Choi, YiSu Park | 2016-07-12 |
| 9281228 | Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die | DaeSik Choi, Minjung Kim, Sang Mi Park, MinWook Yu | 2016-03-08 |
| 9245772 | Stackable package by using internal stacking modules | Choongbin Yim, KeonTeak Kang, YoungChul Kim | 2016-01-26 |