Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524955 | Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure | Rui Huang, Yaojian Lin, Seng Guan Chow | 2016-12-20 |
| 9524938 | Package-in-package using through-hole via die on saw streets | Byung Tai Do, Seng Guan Chow | 2016-12-20 |
| 9515016 | Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant | Rui Huang, Il Kwon Shim, Seng Guan Chow | 2016-12-06 |
| 9406647 | Extended redistribution layers bumped wafer | Byung Tai Do | 2016-08-02 |
| 9299648 | Integrated circuit packaging system with patterned substrate and method of manufacture thereof | Il Kwon Shim, Seng Guan Chow | 2016-03-29 |
| 9293350 | Semiconductor package system with cavity substrate and manufacturing method therefor | Seng Guan Chow, Rui Huang | 2016-03-22 |
| 9275877 | Semiconductor device and method of forming semiconductor package using panel form carrier | Yaojian Lin, Rui Huang, Seng Guan Chow | 2016-03-01 |
| 9257356 | Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices | Rui Huang, Yaojian Lin, Seng Guan Chow | 2016-02-09 |