Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039951 | Thermally enhanced semiconductor package and method of producing the same | Kolan Ravi Kanth, Danny Retuta, Hien Boon Tan, Susanto Tanary, Patrick Low Tse Hoong | 2011-10-18 |
| 7883938 | Stacked die semiconductor package and method of assembly | Ravi Kanth Kolan, Liu Hao, Toh Chin Hock | 2011-02-08 |