Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039951 | Thermally enhanced semiconductor package and method of producing the same | Danny Retuta, Hien Boon Tan, Anthony Sun-Yi Sheng, Susanto Tanary, Patrick Low Tse Hoong | 2011-10-18 |