Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039951 | Thermally enhanced semiconductor package and method of producing the same | Kolan Ravi Kanth, Danny Retuta, Anthony Sun-Yi Sheng, Susanto Tanary, Patrick Low Tse Hoong | 2011-10-18 |
| 8030768 | Semiconductor package with under bump metallization aligned with open vias | Roel Adeva Robles, Danny Retuta, Mary Annie Cheong, Anthony Yi Sheng Sun, Richard Te Gan | 2011-10-04 |