Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030768 | Semiconductor package with under bump metallization aligned with open vias | Roel Adeva Robles, Danny Retuta, Mary Annie Cheong, Hien Boon Tan, Richard Te Gan | 2011-10-04 |
| 7948095 | Semiconductor package and method of making the same | Catherine Bee Liang Ng, Chin Hock Toh | 2011-05-24 |